1. 2. 3. material content data sheet sales product name bga 825l6s e6327 issued 30. april 2015 ma# MA001056000 package pg-tslp-6-3 weight* 0.83 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.214 25.94 25.94 259441 259441 bumps noble metal silver 7440-22-4 0.000 0.00 17 non noble metal tin 7440-31-5 0.001 0.07 739 non noble metal copper 7440-50-8 0.006 0.73 0.80 7332 8088 leadframe non noble metal nickel 7440-02-0 0.110 13.34 13.34 133407 133407 encapsulation organic material carbon black 1333-86-4 0.002 0.28 2804 plastics epoxy resin - 0.067 8.13 81323 inorganic material silicondioxide 60676-86-0 0.394 47.69 56.10 476721 560848 leadfinish noble metal gold 7440-57-5 0.011 1.28 1.28 12841 12841 plating noble metal silver 7440-22-4 0.021 2.53 2.53 25273 25273 ubm non noble metal copper 7440-50-8 0.000 0.01 67 non noble metal titanium 7440-32-6 0.000 0.00 23 non noble metal tungsten 7440-33-7 0.000 0.00 0.01 12 102 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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